ICT
Next-Generation Ultra-High-Speed Photonics ICs via Heterogenous Integration of LNOI and InP Platforms
Runtime: 1 Sept 2022 to 31 Aug 2026
Consortium: 10 partners from 6 countries
Funding programme: Horizon Europe, grant agreement number 101070506; UK Research and Innovation; SERI (Switzerland).
Total budget: 6.7 M€
Coordinator: THALES Research & Technology (France)
Website: www.pattern-project.eu
Project teaser
Acronym: PATTERN
PATTERN will bring long-awaited breakthroughs in the field of Photonic Integrated Circuits (PICs) and provide unrivalled new functionalities for a vast range of applications. The project will devise the world’s first Process Design Kit (PDK) and Assembly Design Kit (ADK) for microwave photonics at ultra‐high frequencies above 100 GHz, new methods for heterogenous integration of III-v gain materials (e.g. InP), as well as BiCMOS drivers with an electro-optic and nonlinear platform of thin-film lithium niobate on insulator (LNOI). It will also develop new functionalities in PICs, such as acousto-optic modulation (AOM) and optical isolation capabilities. PATTERN’s impact will be showcased through several demonstrators, from quantum to satellite free-space communications to ultrastable optical-based RF sources. The results of PATTERN will be accessible to the photonics community in the form of an open-access foundry.